Material Division
Business overview
It is used for bonding and gasket sealing in electronic components, as well as assembly of various electronic products. Depending on the curing process,
it is divided into room temperature curing type and heat curing type. You can choose the product considering factors such as viscosity, hardness, and adhesive strength.
It is used for applying a protective coating of uniform thickness on the surface of parts and is divided into solvent-based and solvent-free types,
making viscosity adjustment easy. You can choose the product considering factors such as viscosity, coating process, and curing conditions (room temperature and UV)
It is divided into elastomer-type encapsulation and a flexible gel type. Thick application is common for protecting parts with housings, and some products also incorporate heat dissipation functions
It is a product blended with inorganic fillers to facilitate heat conduction. You can choose between processing conditions,
heat dissipation performance, and whether it's a 1-part or 2-part formulation. Additionally, there are products with a lower cost that incorporate low-density fillers,
taking product pricing into consideration
It is environmentally friendly and can achieve excellent flame retardant performance compared to urethane foam.
You can choose the product based on factors such as viscosity, hardness, and expansion ratio. Additionally, there are products available with a consistent thickness (2~10T)
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