본문 바로가기 주메뉴 바로가기

소재 사업부

C.A.S.E

제품 소개

샌드위치 패널 접착제

샌드위치 패널 접착제
Product Reactivity(GT, sec) Viscosity(cps, @25℃) Remark
EPA-920 16~25 700±150 General usage
EPA-900 16~25 700±150 Strong adhension
EPA-940 16~30 540±150 Spray type
BL-350 25~30 300±1150 Side packing of GW/MW panel

방화문 접착제

방화문 접착제
Product NCO%(wt%) Viscosity(cps, @25℃) Remark
KSE-100 13.5±0.5 1,500±500 Steel/Honeycomb, EPS or PU
(solvent type)
KSE-200 13.5±0.5 2,500±500 Steel/Honeycomb, EPS or PU
(non-solvent type)

폴리우레아 코팅

폴리우레아 코팅
Product Type Hardness(Shore A) Application
UA-80(A/B) Pure urea Pure urea Pure urea
UA-90(A/B) Pure urea Pure urea Pure urea
UA-95(A/B) Pure urea Pure urea Pure urea
HS-80(A/B) Hybrid Hybrid Hybrid
HS-90(A/B) Hybrid Hybrid Hybrid
HS-95(A/B) Hybrid Hybrid Hybrid
PUA-90T(A/B) Hybrid Hybrid Hybrid
UAR-90(A/B) Urea Urea Urea
ULP-90(A/B) Urea Urea Urea
SSH-70(A/B) Urethane(no yellowing) Urethane(no yellowing) Urethane(no yellowing)

방수재(노출 타입)

방수재(노출 타입)
Items Flexible Semi-Rigid Rigid High-Rigid
Grade GC-40 GC-401 GC-401 GC-601 GC-100 GC-80 GC-801 GC-802 GC-95 GC-951
Resin Hardner Resin Hardner One Comp. Resin Hardner Hardner Resin Hardner
Viscosity(25℃, cps) 9,000±1,000 9,000±1,000 6,000±1,000 10,000±1,000 4,000±2,000 4,000±1,000 6,000±2,000 12,000±2,000 8,000±2,000 8,000±2,000
Ratio 1 2.5 1 1.25 - 1 1 2 1 1
Pot Life(25℃, min) 40±20 40±20 40±20 40±20 40±20 40±20
Harndess(Shore A) 40±5 60±5 55±5 48±5 80±5 90±5

그라우팅

그라우팅
Product Expanding Ratio(%) Viscosity(cps, @25℃) Remark
SW-F 1,000~1,500 400~800 Flexible type
SW-R 1,000~2,500 800~1,500 Rigid type

콘크리트 보수 소재

콘크리트 보수 소재
Product Curing Time(min) Hardness(Shore D) Remark
RCU-200(A/B) 2 55 Urethane type
RCU-300(A/B) 2 70 Urea type

탄성 콘크리트 몰탈

탄성 콘크리트 몰탈
Product PART Ratio(kg) Compressive St Elasiticity
MEGAD EEM A/B/C=2.2/4.3/32.6 15.0 MPa 90%
ASTM Test Method D695 D695

칩 바인더

칩 바인더
Product Usage NCO contents(wt%) Viscosity(cps, @25℃) Remak
KCB-201 Chip binder 6.7±0.5 6.7±0.5 Prepolymer
KCB-50 Chip binder 8.0±1.0 8.0±1.0 Prepolymer
KCB-60 Chip binder 8.0±1.0 8.0±1.0 Prepolymer
KCB-70 Chip binder 8.7±0.5 8.7±0.5 Prepolymer
TOP